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4 DP nodes in 2U; depth 28.5″, Each Node:
Dual Socket P (LGA 3647) support: Intel® Xeon® Scalable processors; dual UPI up to 10.4GT/s
24 DIMMs; up to 3TB ECC 3DS LRDIMM or RDIMM DDR4‑2666MHz
4 Hot-swap 2.5″ NVMe/SATA3 + 2 Hot-swap 2.5″ SATA3 drive bays per node
2 PCI-E 3.0 x16 Low-profile slots, 1 Networking SIOM card support
1 Dedicated IPMI port, 1 VGA, 2 USB 3.0, 1 SuperDOM
4 heavy duty 80mm fans w/ optimal fan speed control
2200W Redundant Titanium Level (96%) Power Supplies

4 DP nodes in 2U; depth 28.75″, Each Node:
Dual Socket P (LGA 3647) support: Intel® Xeon® Scalable processors; 3 UPI up to 10.4GT/s
24 DIMMs; up to 3TB ECC 3DS LRDIMM or RDIMM DDR4 2666MHz
6 Hot-swap 2.5″ NVMe drive bays per node; 2 M.2 SATA3 or NVMe support
2 PCI-E 3.0 x16 Low-profile slots, 1 Networking SIOM card support
1 Dedicated IPMI port, 1 VGA, 2 USB 3.0, 1 SuperDOM
16 Heavy duty 40x56mm fans w/ optimal fan speed control (4 fans per node)
2600W Redundant Titanium Level (96%) Power Supplies

4 DP nodes in 2U; depth 28.5″, Each Node:
Dual Socket P (LGA 3647) support: Intel® Xeon® Scalable processors; dual UPI up to 10.4GT/s
24 DIMMs; up to 3TB ECC 3DS LRDIMM or RDIMM DDR4‑2666MHz
6 SAS3 or 4 NVMe + 2 SAS3 Hot-swap 2.5″ drive bays per node
SAS3 support via Broadcom 3108; RAID 0, 1, 5, 6, 10, 50, 60
1 PCI-E 3.0 x16 Low-profile slot, 1 Networking SIOM card support
1 Dedicated IPMI port, 1 VGA, 2 USB 3.0, 1 SuperDOM
4 heavy duty 80mm fans w/ optimal fan speed control
2200W Redundant Titanium Level (96%) Power Supplies

4 DP nodes in 2U; depth 28.5″, Each Node:
Dual Socket P (LGA 3647) support: Intel® Xeon® Scalable processors; dual UPI up to 10.4GT/s
24 DIMMs; up to 3TB ECC 3DS LRDIMM or RDIMM DDR4‑2666MHz
6 Hot-swap 2.5″ NVMe drive bays per node
2 PCI-E 3.0 x16 Low-profile slots, 1 Networking SIOM card support
1 Dedicated IPMI port, 1 VGA, 2 USB 3.0, 1 SuperDOM
4 heavy duty 80mm fans w/ optimal fan speed control
2200W Redundant Titanium Level (96%) Power Supplies

4 DP nodes in 2U; depth 28.5″, Each Node:
Dual Socket P (LGA 3647) support: Intel® Xeon® Scalable processors; dual UPI up to 10.4GT/s
24 DIMMs; up to 3TB ECC 3DS LRDIMM or RDIMM DDR4‑2666MHz
6 SAS3 or 4 NVMe + 2 SAS3 Hot-swap 2.5″ drive bays per node
SAS3 support via Broadcom 3008; IT mode
2 PCI-E 3.0 x16 Low-profile slots, 1 Networking SIOM card support
1 Dedicated IPMI port, 1 VGA, 2 USB 3.0, 1 SuperDOM
4 heavy duty 80mm fans w/ optimal fan speed control
2200W Redundant Titanium Level (96%) Power Supplies

4 DP nodes in 2U; depth 28.5″, Each Node:
Dual Socket P (LGA 3647) support: Intel® Xeon® Scalable processors; dual UPI up to 10.4GT/s
24 DIMMs; up to 3TB ECC 3DS LRDIMM or RDIMM DDR4‑2666MHz
6 Hot-swap 2.5″ SATA3 drive bays per node
2 PCI-E 3.0 x16 Low-profile slots, 1 Networking SIOM card support
1 Dedicated IPMI port, 1 VGA, 2 USB 3.0, 1 SuperDOM
4 heavy duty 80mm fans w/ optimal fan speed control
2200W Redundant Titanium Level (96%) Power Supplies

2 DP nodes in 2U; depth 28.5″, Each Node:
Dual Socket P (LGA 3647) support: Intel® Xeon® Scalable processors; dual UPI up to 10.4GT/s
24 DIMMs; up to 3TB ECC 3DS LRDIMM or RDIMM DDR4‑2666MHz
4 NVMe/SAS3 + 8 SAS3 Hot-swap 2.5″ drive bays per node
SAS3 (12Gbps) support via Broadcom 3216; IT mode
2 PCI-E 3.0 x8, 1 PCI-E 3.0 x16, 1 Networking SIOM card support
1 Dedicated IPMI port, 1 VGA, 2 USB 3.0, 1 SuperDOM
4 heavy duty 80mm fans w/ optimal fan speed control
2200W Redundant Titanium Level (96%) Power Supplies

2 DP nodes in 2U; depth 30.11″, Each Node:
Dual Socket P (LGA 3647) support: Intel® Xeon® Scalable processor; dual UPI up to 10.4GT/s
24 DIMM slots; up to 3TB ECC 3DS L/RDIMM, up to DDR4‑2666MHz
3 NVMe/SAS3 + 3 SAS3 Hot-swap 3.5″ drive bays per node, 2 Internal M.2 NVMe/SATA slots
SAS3 support via Broadcom 3008; IT mode
2 PCI-E 3.0 x8, 1 PCI-E 3.0 x16, 1 Networking SIOM card support
1 Dedicated IPMI port, 1 VGA, 2 USB 3.0, 1 SuperDOM
4 heavy duty 80mm fans w/ optimal fan speed control
2200W Redundant Titanium Level (96%) Power Supplies

4 DP nodes in 2U; depth 30.11″, Each Node:
Dual Socket P (LGA 3647) support: Intel® Xeon® Scalable processors; dual UPI up to 10.4GT/s
24 DIMM slots; up to 3TB ECC 3DS L/RDIMM, up to DDR4‑2666MHz
3 Hot-swap NVMe/SAS3 drive bays per node
SAS3 support via Broadcom 3008; IT mode
2 PCI-E 3.0 x16 Low-profile slots, 1 Networking SIOM card support
1 Dedicated IPMI port, 1 VGA, 2 USB 3.0, 1 SuperDOM
4 heavy duty 80mm fans w/ optimal fan speed control
2200W Redundant Titanium Level (96%) Power Supplies

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